Modular Data Center Market and its Key Opportunities and Challenges

November 15 09:34 2019
Modular Data Center Market and its Key Opportunities and Challenges

Huawei Technologies Co., Ltd. (China); International Business Machines (IBM) Corporation (US); Eaton Corporation (Ireland); BladeRoom (UK); Cannon Technologies Ltd. (UK); Commscope Inc. (US); Dell Inc. (US); Flexenclosure AB (Sweden); Hewlett Packard Enterprise(HPE) Development LP (US); Rittal GmbH & Co. KG (Germany); Schneider Electric SE(France); Vertiv Co. (US); and Baselayer Technology, LLC..(US)
Modular Data Center Market by Functional Module Solution (All-In-One Module and Individual Module), Service, Data Center Size, Tier Type, Industry, and Region – Global Forecast to 2022

The Modular Data Center Market size is expected to grow from USD 13.07 Billion in 2017 to USD 46.50 Billion by 2022, at a Compound Annual Growth Rate (CAGR) of 28.90%, as per a report by MarketsandMarkets. 

How deployments in disaster-prone areas is an opportunity for Modular Data Centers?

Disaster recovery is a major concern for data center users across the globe. Modular data centers are a cost-effective alternative for disaster recovery, and can be deployed in environments where traditional data centers cannot be deployed, as they are weatherproof, sound proof, and can sustain extreme temperatures in outdoor as well as indoor environments. Modular data center can act as a temporary data center in situations where the main data center has been affected by natural calamities or other disasters, or where the expertise to build a data center is not available. These benefits are making modular data centers an attractive option in the disaster recovery strategy of an organization.

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Why rise in HVAC needs poses a challenge?

Modular data centers, in recent years, have become extremely powerful and are being widely used for enterprise data requirements. They are capable of supporting densities of 20–30 kW or higher and end up generating high levels of heat per square foot. The high levels of heat generated pressurize the overall resource spent on the heating, ventilation, and air conditioning (HVAC) systems and services in the modular data center systems, and further increases data center costs. High heat density levels are forcing organizations to expand their cooling infrastructure and increase their air-conditioning capabilities. In spite of this increased air conditioning, it is challenging to avoid the temporary failure of the data center, due to overheating. These complications involved in managing the heat levels inside modular data centers may hinder the growth of the global modular data center market shortly.

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Some of the major technology vendors include Huawei Technologies Co., Ltd. (China); International Business Machines (IBM) Corporation (US); Eaton Corporation (Ireland); BladeRoom (UK); Cannon Technologies Ltd. (UK); Commscope Inc. (US); Dell Inc. (US); Flexenclosure AB (Sweden); Hewlett Packard Enterprise(HPE) Development LP (US); Rittal GmbH & Co. KG (Germany); Schneider Electric SE(France); Vertiv Co. (US); and Baselayer Technology, LLC..(US).

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